WAFER LEVEL LENS ARRAYS FOR IMAGE SENSOR PACKAGES AND THE LIKE, IMAGE SENSOR PACKAGES, AND RELATED METHODS

摘要

Image sensor packages, lenses therefore, and methods for fabrication are disclosed. A substrate having through-hole vias may be provided, and an array of lenses may be formed in the vias. The lenses may be formed by molding or by tenting material over the vias. An array of lenses may provide a color filter array (CFA). Filters of the CFA may be formed in the vias, and lenses may be formed in or over the vias on either side of the filters. A substrate may include an array of microlenses, and each microlens of the array may correspond to a pixel of an associated image sensor. In other embodiments, each lens of the array may correspond to an imager array of an image sensor. A wafer having an array of lenses may be aligned with and attached to an imager wafer comprising a plurality of image sensor dice, then singulated to form a plurality of image sensor packages.