SOLDERING METHOD, SOLDER PELLET FOR DIE BONDING, METHOD FOR MANUFACTURING SOLDER PELLET FOR DIE BONDING AND ELECTRONIC COMPONENT

摘要

A pellet for use in die bonding of an electronic chip and a substrate in an electronic component generates minimized voids in spite of the pellet being made of a lead-free solder. The pellet forms a colorless transparent protective film comprising Sn-(30 - 50 at % O) -(5 - 15 at % P) or Sn-(10 - 30 at % In)-(40 - 60 at % O)-(5 - 15 at % P) when heated for soldering, has a thickness of 0.05 - 1 mm, and has generally the same shape as the semiconductor chip to be bonded to the substrate.