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Low Temperature Bonding by Infiltrating Sn3.5Ag Solder into Porous Ag Sheet for High Temperature Die Attachment in Power Device Packaging

机译：通过渗透SN3.5AG焊料在功率装置包装中的高温模具附件中的焊料中的低温粘合

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Chunjin Hang; Junjian He; Zhihao Zhang; Hongtao Chen; Mingyu Li;
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年度 2018
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1. Low Temperature Bonding by Infiltrating Sn3.5Ag Solder into Porous Ag Sheet for High Temperature Die Attachment in Power Device Packaging [J] . Chunjin Hang, Junjian He, Zhihao Zhang, Scientific reports. . 2018,第1期

机译：通过渗透SN3.5AG焊料在功率装置包装中的高温模具附件中的焊料中的低温粘合
2. A low-temperature bonding method for high power device packaging based on In-infiltrated nanoporous Cu [J] . Chunjin Hang, Jiahao Liu, Jianqiang Wang, Journal of materials science . 2020,第17期

机译：基于渗透纳米多孔Cu的高功率器件包装低温粘接方法
3. A low temperature die attach technique for high temperature applications based on indium infiltrating micro-porous Ag sheet [J] . Xie Xingchi, Hang Chunjin, Wang Jianqiang, Journal of materials science . 2018,第21期

机译：一种基于铟渗透微孔银片的高温模具低温贴装技术
4. Solvent effect on pressureless and low-temperature sintering of Ag paste for die-attachment in high-power devices [C] . Hao Zhang, Chuantong Chen, Jinting Jiu, International Conference on Electronic Packaging Technology . 2017

机译：高功率器件中AG浆料无用和低温烧结的溶剂效果
5. Effects of plasma, temperature and chemical reactions on porous low dielectric films for semiconductor devices [D] . Osei-Yiadom, Eric 2010

机译：等离子体，温度和化学反应对半导体器件多孔低介电膜的影响
6. Low Temperature Bonding by Infiltrating Sn3.5Ag Solder into Porous Ag Sheet for High Temperature Die Attachment in Power Device Packaging [O] . Chunjin Hang, Junjian He, Zhihao Zhang, -1

机译：通过将Sn3.5Ag焊料渗透到多孔Ag片中进行低温粘结以用于功率器件包装中的高温芯片附着
7. Brief review of silver sinter-bonding processing for packaging high-temperature power devices [O] . Haidong Yan, Peijie Liang, Yunhui Mei, 2020

机译：浅谈封装高温功率器件的银烧结加工

Low Temperature Bonding by Infiltrating Sn3.5Ag Solder into Porous Ag Sheet for High Temperature Die Attachment in Power Device Packaging

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