Measurement of the thermomechanical behaviour f the solder-lead interface in solder joints by laser probing: a new method for measuring the bond quality.

摘要

We present an original method of laser probing to observe thermomechanical stresses at interfaces of solder joints. The stress is generated by Peltier heat exchange and observed through thermal expansion in the picometer scale. A simple model allows to extract a parameter measuring the interface bond quality.