SOLDERING METHOD, SOLDER PELLET FOR DIE BONDING, METHOD FOR MANUFACTURING SOLDER PELLET FOR DIE BONDING AND ELECTRONIC COMPONENT

摘要

when bonding the die-bonding a semiconductor element and the substrate of the electronic component , even though the pellets of lead-free solder , to a small pellet in the generation of voids on the surface of the lead-free solder alloy of Sn main component , a colorless transparent Sn-30~50at.% O-5~15at% P or Sn-10~30at.% In-40~ a pellet formed at the time of heating the solder protective layer made of a 60at.% O-5-15at% P, and the thickness 0.05~1 , the shape is substantially the same as the substrate .