METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND GATE OF DEVICE FOR RESIN-SEALING SURFACE OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To reduce the damage to a semiconductor wafer to the utmost by reducing the force applied to the semiconductor wafer to the utmost in a process for mounting the semiconductor wafer in a mold to seal the surface of the wafer with a resin.;SOLUTION: An impact relaxing means for reducing the force applied to the semiconductor wafer is provided under a lower mold.;COPYRIGHT: (C)2002,JPO