DEVICE FOR RESIN-SEALING SEMICONDUCTOR WAFER MOLD FOR MANUFACTURING SEMICONDUCTOR DEVICE GATE OF DEVICE FOR RESIN-SEALING SURFACE OF SEMICONDUCTOR WAFER METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR WAFER FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: To reduce the damage to a semiconductor wafer to the utmost by reducing the force applied to the semiconductor wafer to the utmost in a process for mounting the semiconductor wafer in a mold to seal the surface of the wafer with a resin. CONSTITUTION: An impact relaxing means for reducing the force applied to the semiconductor wafer is provided under a lower mold.