DEVICE FOR RESIN-SEALING SEMICONDUCTOR WAFER, AND MOLD FOR MANUFACTURING SEMICONDUCTOR DEVICE, GATE OF DEVICE FOR RESIN-SEALING SURFACE OF SEMICONDUCTOR WAFER

摘要

An object of the present invention, by the step of mounting the semiconductor wafer in a mold, and resin sealing the surface of the wafer, a possible reduction of force applied to the semiconductor wafer, and so to reduce the damage of the semiconductor wafer. In a typical invention of this present application, the shock-absorbing means for the bottom of the lower mold to reduce the force applied to the semiconductor wafer is provided. ; A semiconductor wafer, a resin sealing device, a mold, shock absorbers, the gate portion, cull