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SELF-ALIGNED IMPACT-IONIZATION FIELD EFFECT TRANSISTOR

机译:自对准冲击电离场效应晶体管

摘要

An impact ionisation MOSFET is formed with the offset from the gate to one of the source/drain regions disposed vertically within the device structure rather than horizontally. The semiconductor device comprises a first source/drain region having a first doping level; a second source/drain region having a second doping level and of opposite dopant type to the first source/drain region, the first and second source/drain regions being laterally separated by an intermediate region having a doping level less than either of the first and second doping levels; a gate electrode electrically insulated from, and disposed over, the intermediate region, the first and second source/drain regions being laterally aligned with the gate electrode; where the entire portion of the first source/drain region that forms a boundary with the intermediate region is separated vertically from the top of the intermediate region.
机译:形成碰撞电离MOSFET,其从栅极到源/漏区之一的偏移垂直放置在器件结构内,而不是水平放置。该半导体器件包括具有第一掺杂水平的第一源极/漏极区;以及第一源极/漏极区。第二源极/漏极区域具有第二掺杂水平并且与第一源极/漏极区域具有相反的掺杂剂类型,第一和第二源极/漏极区域被具有小于第一和第二掺杂水平的掺杂水平的中间区域横向隔开。第二掺杂水平;与中间区域电绝缘并设置在中间区域上的栅电极,第一和第二源/漏区与栅电极横向对准;其中与中间区域形成边界的第一源/漏区域的整个部分与中间区域的顶部垂直分开。

著录项

  • 公开/公告号EP2095427B1

    专利类型

  • 公开/公告日2010-07-21

    原文格式PDF

  • 申请/专利权人 NXP BV;

    申请/专利号EP20070849110

  • 发明设计人 CURATOLA GILBERTO;VAN DAL MARK;SONSKY JAN;

    申请日2007-11-13

  • 分类号H01L29/739;

  • 国家 EP

  • 入库时间 2022-08-21 18:37:37

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