STRUCTURE OF FLIP CHIP BONDING WATER FOR THE RFID TAG CHIP CHOOSING THE EXPANSION BUMP STRUCTURE

摘要

PURPOSE: A structure of flip chip bonding water for the RFID tag chip applies the flip chip bonding technology to the RFID apparatus. The reflection loss of input-output is minimized.;CONSTITUTION: The IC chip comprises the first lateral wall edge part and the second side wall edge part that each other faces. Bonding pads(201, 202) are included in the upper side of the IC chip which is contiguous to the first lateral wall edge part. Bumps(203, 204) touch with the bonding pad. Bump has the length expanded the second side wall edge part. The dummy bump is included in the upper side of the IC chip which is contiguous to the second side wall edge part.;COPYRIGHT KIPO 2010