FLIP CHIP BONDING STRUCTURE FOR RFID TAG CHIP

摘要

The present invention is a flip chip bonding structures that can be applied to the RFID tag chip to prevent the reflection loss of the input and output as for providing a flip-chip bonding structure of the present invention is an RFID tag having a chip portion and the second side wall portion to the first side wall opposite the at least one another; Two bonding pads provided on an upper surface of the RFID tag chip adjacent to the portion on the first side wall; And while in contact with the bonding pad includes two bumps has a length extended in the direction in which the portions symmetrical to each other on the second side wall, the present invention By applying the above-described flip-chip bonding technique to the RFID device of the semiconductor chip and the substrate The connection length is minimized impedance is close to 0, whereby the input and output return loss of the effect can be minimized. In addition, the present invention employs a structure extended bump extended bump connected to one bonding pad without dummy pad (Dummy Pad) is extended to the protective layer, a separate bonding pad without physical stability is guaranteed to the lower.