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Electronic Materials and Packaging,EMAP, 2008 International Conference on

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1.New LTCC material with high adhesion and flexural strength

机译：具有高附着力和抗弯强度的新型LTCC材料
- 作者：Ko Minji;Lyoo SooHyun;Lee Jongmyeon;Park EunTae
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
2.Residual stress estimation in SiC wafer using IR polariscope

机译：使用红外偏光镜估算SiC晶片中的残余应力
- 作者：Gomi Kenji;Ichinose Kensuke;Niitsu Yasushi
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
- Residual stress;
- Silicon carbide;
- photoelasticity;
3.Nanoindentation analysis of interfacial IMCs in electronic solder joints

机译：电子焊点中界面IMC的纳米压痕分析
- 作者：Yu-Lin Shen;Jenn-Ming Song;Chien-Wei Su
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
- Intermetallic compounds;
- Nanoindentation;
- Strain rate sensitivity exponent;
4.Drop impact reliability of Cu-Zn/Sn-Ag-Cu/Cu-Zn solder joints

机译：Cu-Zn / Sn-Ag-Cu / Cu-Zn焊点的跌落冲击可靠性
- 作者：Kim Young Min;Kim Young-Ho
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
5.Unique dry film solution for Through Silicon Via Process

机译：硅通孔工艺的独特干膜解决方案
- 作者：Bin-Hong Tsai;Jorge Pedro;Balut Chester E.
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
- DuPont;
- Interconnects;
- MPFs;
- Through Silicon Vias;
- dry film;
6.Electromigration study of eutectic SnPb flip-chip solder joints on ceramic substrates

机译：陶瓷基体上共晶SnPb倒装焊点的电迁移研究
- 作者：Lin C. K.;Chen Chih;Yu H. M.;Lan J. K.;Lee D. L.
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
7.Parameter extractions and a new calibration methodology for MOSFET sensors

机译：MOSFET传感器的参数提取和新的校准方法
- 作者：Chun-Pai Tang;Hsien Chung;Yung-Ching Chao;Ben-Je Lwo
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
8.A capacitive low-g three-axis accelerometer

机译：电容式低重力三轴加速度计
- 作者：Hsu Y. W.;Chien H. T.;Lin C. S.;Liao L. P.;Chen S.;Chang P.
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
9.Fabrication of high density and high conplanarity lead-free solder bump by a novel process for advanced wafer level packaging

机译：通过先进的晶圆级封装的新工艺制造高密度和高共平面度的无铅焊料凸点
- 作者：Hsu Hou-Jun;Huang Jung-Tang;Lee Kuo-Yu;Wu Rung-Gen;Chao Pen-Shan;Lin Jean
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
10.Mechanical properties of intermetallic compounds formed at the interface between a tin bump and an electroplated copper thin film

机译：在锡凸块和电镀铜薄膜之间的界面处形成的金属间化合物的机械性能
- 作者：Jeong Seongcheol;Sato Yuki;Miura Hideo
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
11.A novel high refractive transparent material in LED package applications

机译：LED封装应用中的新型高折射透明材料
- 作者：Hsun-Tien Li;Chia-Wen Hsu;Kai-Chi Chen
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
12.Proposal of area-arrayed bump joint structures for minimizing residual stress in stacked silicon chips mounted by flip chip technology

机译：提议采用区域阵列的凸点接合结构以最小化通过倒装芯片技术安装的堆叠式硅芯片中的残余应力
- 作者：Ueta Nobuki;Sasaki Takuya;Miura Hideo
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
13.Unique transparent lens formation for high brightness LED by VPES (Vacuum Printing Encapsulation Systems) process

机译：通过VPES（真空印刷封装系统）工艺为高亮度LED形成独特的透明透镜
- 作者：Atsushi Okuno;Yoshiteru Miyawaki;Dongxu Wang;Osamu Tanaka
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
14.Thermal analysis under different packaging processes for MEMS device with diaphragm

机译：带隔膜的MEMS器件在不同封装工艺下的热分析
- 作者：Cheng-Hsin Chuang;Wen-Hui Li;Lee Sony
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
- MEMS;
- diaphragm;
- simulation;
- thermal stress;
15.Development of evaluation approach for delamination considering micro-scale interfacial layer structure between resin and silicon

机译：考虑树脂和硅之间微尺度界面层结构的脱层评估方法的发展
- 作者：Matsumoto Tsubasa;Yu Qiang;Shibutani Tadahiro;Matsuzaki Tomio
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
16.Alloying design of Sn-Ag-Cu solders for the improvement in drop test performance

机译：Sn-Ag-Cu焊料的合金设计可改善跌落测试性能
- 作者：Li-Wei Lin;Song Jenn-Ming;Yi-Shao Lai;Ying-Ta Chiu;Lee Ning-Cheng
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
- Sn-Ag-Cu;
- damping capacity;
- nanoindentation;
- tensile properties;
- transition metals;
17.Effect of parametric randomness on reliability analysis of wafer-level chip-scale packages

机译：参数随机性对晶圆级芯片级封装可靠性分析的影响
- 作者：Wu Wen-Fang;Hsu Teng-Kai;Su Chih-Yen;Chen Yao-Chung;Hsu Yao
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
18.Embedded filter's temperature effect analysis for high frequency applications

机译：嵌入式滤波器对高频应用的温度影响分析
- 作者：Kim Taeeui;Romero Christian;KyungO Kim;Taesung Jung;Sung Yi
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
19.Tolerance analysis for embedded passive in organic substrate

机译：有机基板中嵌入式无源器件的公差分析
- 作者：Kim Taeeui;Kim KyungO;Kim Hongwon;Jung Taesung;Yi Sung
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
20.Fabrication and characterization of epoxy/BaTiO3 composite embedded capacitor for high frequency behaviors

机译：环氧树脂/ BaTiO 3 复合埋入式电容器高频特性的制备与表征
- 作者：Jin-Gul Hyun;Kyung-Wook Paik;Jun So Pak
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
21.The effects of the degree of cure of anisotropic conductive films (ACFs) on the contraction stress build-up of ACFs and ACF joints stability for ACF flip-chip interconnection

机译：各向异性导电膜（ACF）的固化程度对ACF收缩应力累积和ACF倒装芯片互连的ACF接头稳定性的影响
- 作者：Chung Chang-Kyu;Paik Kyung-Wook
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
22.Kinetic study of eutectic Sn-3.5Ag and Electroplated Ni metallization in flip-chip solder joints

机译：倒装芯片焊点中共晶Sn-3.5Ag和电镀镍金属化的动力学研究
- 作者：Chen Hsiao-Yun;Chen Chih
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
23.Structural optimization of contact springs of electrical connectors using response surface methodology

机译：使用响应面方法优化电连接器接触弹簧的结构
- 作者：Chen Kun-Nan;Gau Fu-Tsuen;Chu Cheng-Chin;Cheng Hsien-Chie
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
24.High-performance Marchand-type balun design and fabrication using an integrated passives device (IPD) technology

机译：使用集成无源器件（IPD）技术的高性能Marchand型巴伦设计和制造
- 作者：Chien-Hsiang Huang;Tzu-Chiang Wei;Tzyy-Sheng Horng;Sung-Mao Wu;Chen-Chao Wang;Chi-Tsung Chiu;Chih-Pin Hung
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
- Integrated Passive Device;
- Marchand Balun;
- spiral transmission line;
25.Effect of alloying W in Ni(5P) metallization of solder joints

机译：W合金化对焊点Ni（5P）金属化的影响
- 作者：Jang D. M.;Yu Jin
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
26.The contact stress analysis of the ferrule-hub assembly used in the photonic device packaging

机译：光子器件包装中使用的套圈-轮毂组件的接触应力分析
- 作者：En Lin Samuel I.;Chen Yu Kai
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
27.Design, fabrication, and property measurement of a zero-insertion-force (ZIF) MEMS connector

机译：零插入力（ZIF）MEMS连接器的设计，制造和性能测量
- 作者：Ben-Hwa Jang;Hsin-Yu Huang;Weileun Fang;Shin-Way Lin
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
28.Extraction of micro-contact properties using a novel micromachined on-chip apparatus

机译：使用新型微加工的片上设备提取微接触特性
- 作者：Jang Ben-Hwa;Tseng Po-Hsun;Fang Weileun;Lin Shin-Way
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
29.Development of a miniature surface mount system using injection molding pantograph mechanisms

机译：利用注塑受电弓机构开发微型表面安装系统
- 作者：Mikio Horie;Yohei Kai;Daiki Kamiya
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
30.A method of fabricating MEMS accelerometers

机译：一种MEMS加速度计的制造方法
- 作者：Chen S.;Chien H. T.;Lin J. Y.;Hsu Y. W.
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
31.Evaluation of residual stress in a transistor using micron scale strain sensors

机译：使用微米级应变传感器评估晶体管中的残余应力
- 作者：Sasaki Takuya;Ueta Nobuki;Miura Hideo
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
32.Development of a non-destructive inspection system for micro bump joints

机译：开发微凸点接头无损检测系统
- 作者：Sato Yuki;Miura Hideo
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
33.Mechanical behavior of lead-free solder joints under high speed shear test at different pad metallization substrate

机译：无铅焊点在不同焊盘金属化衬底上高速剪切试验下的力学行为
- 作者：Lin C. Y.;Chen Y. R.;Shen G. S.;Liu D. S.;Kuo C. Y.;Hsu C. L.
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
34.Lead-free solder paste selection and solder joint reliability for copper stud flip chip

机译：铜柱倒装芯片的无铅焊膏选择和焊点可靠性
- 作者：Fon Bih Wen;Shutesh Krishnan;Yo Meng Chan
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
35.Reliability and wear-out characterization of BGA production sockets

机译：BGA生产插座的可靠性和磨损特性
- 作者：Hou Shu-Jung;Huang Yu-Jung;Chen Ming-Kun;Fu Shen-Li
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
36.Optical density measurement of TFT-LCD by PMT coupled monochrome LED

机译：PMT耦合单色LED测量TFT-LCD的光密度
- 作者：Fu-Ming Tzu;Jung-Hua Chou
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
- Optical density;
- black matrix;
- halogen lamp;
- light emitted diode;
- neutral density filter;
- photomultiplier-tube photovoltaic effect;
37.Fatigue strength of electroplated copper thin films under uni-axial stress

机译：单轴应力下电镀铜薄膜的疲劳强度
- 作者：Murata Naokazu;Tamakawa Kinji;Suzuki Ken;Miura Hideo
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
38.The microstructure and fracture behavior of Sn-3Ag-0.5Cu solder joints

机译：Sn-3Ag-0.5Cu焊点的组织和断裂行为
- 作者：Wang T. S.;Liu S. C.;Huang Y. L.;Lin K. L.;Lai Y.S.
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
39.RFID implementation in inventory management of wafer cassettes and probe cards in wafer testing houses

机译：晶圆测试室中晶圆盒和探针卡的库存管理中的RFID实现
- 作者：Lee Michael;Huang C.F.;An-Hong Liu;Yi-Chang Lee
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
- RFID;
- Wafers;
- ZigBee;
- probe card;
- wafer cassette;
40.Monitoring of interface crack between solder ball and copper plate subjected to cyclic tensile loading under fluctuating temperature by direct current potential difference method

机译：直流电势差法监测波动温度下承受周期性拉伸载荷的焊球与铜板界面裂纹
- 作者：Tada Naoya;Ezaki Yusuke
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
41.Effect of lead-free soldering on key material properties of FR-4 printed circuit board laminates

机译：无铅焊接对FR-4印刷电路板层压板关键材料性能的影响
- 作者：Sanapala Ravikumar;Sood Bhanu;Das Diganta;Pecht Michael;Huang C. Y.;Tsai M. Y.
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
42.Thermal resistance and reliability of low-cost high-power LED packages under WHTOL test

机译：经过WHTOL测试的低成本大功率LED封装的热阻和可靠性
- 作者：Chen C. H.;Tsai W. L.;Tsai M. Y.
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
- LED;
- junction temperature;
- reliability;
- thermal;
43.Variability-aware lTCC spiral inductor synthesis

机译：可变性lTCC螺旋电感器综合
- 作者：Tuck-Boon Chan;Hsin-Chia Lu
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
44.Recent progress in copper-based wafer bonding for 3-D ICs application

机译：用于3D IC应用的铜基晶圆键合的最新进展
- 作者：Tan Chuan Seng
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
45.An accommodative approach designed in heat dispersion of fine-pitch Chip-On-Film packages for LCD applications

机译：专为LCD应用而设计的细间距膜上芯片封装的散热方法
- 作者：Tsai C. I.;Liu A. H.;Ho S. C.;Liu D. S.;Yeh S. S.;Chang Y. F.
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
- Chip-on-film (COF);
- Finite Element Analysis (FEA);
- Ionic migration;
46.Development of surface mount compatible reel-to-reel assembly Process of LED arrays for wide area general lighting

机译：开发了与表面安装兼容的卷到卷装配式LED阵列的工艺，适用于广域通用照明
- 作者：Lee S. W. Ricky;Tong Y. W.;Chan Y. S.;Lo J. C. C.;Zhang R.
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
47.Effect of transition metals on the interfacial reactions in electroless Ni(P)-solder interconnections

机译：过渡金属对化学镀Ni（P）-焊料互连中界面反应的影响
- 作者：Liu Yao-Ren;Song Jenn-Ming;Lai Yi-Shao;Chiu Ying-Ta;Chen Wei-Ting
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
48.Fabrication and characterization of passive devices on flexible substrates

机译：在柔性基板上制造和表征无源器件
- 作者：Pei-Ju Lin;Hung-Ming Chang;Ching-Chien Yuan;Yu-Jung Huang;Lih-Shan Chen;Hsiang-Chen Hsu;Shen-Li Fu
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
49.Interconnect reliability modeling for lead-free fan-out chip scale package

机译：无铅扇出芯片级封装的互连可靠性建模
- 作者：Yu-Ren Chen;Shen G. S.;Hung-Chun Yang;Tz-Cheng Chiu
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
- Board-level reliability;
- Design of simulations;
- Fan-out-type chip scale package;
50.Post-mold cure process simulation of IC packaging

机译：IC封装的模制后固化过程仿真
- 作者：Chi-Hong Shue;Sheng-Jye Hwang;Huei-Huang Lee;Durn-Yuan Huang;Yao-Jung Lee
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
- ANSYS;
- EMC;
- post mold cure;
- shift factor;
- viscoelastic simulation;
51.Analysis of flip-chip corner delamination using 3-D virtual crack closure technique

机译：使用3-D虚拟裂纹闭合技术分析倒装芯片角部分层
- 作者：Tz-Cheng Chiu;Huang-Chun Lin;Hung-Chun Yang
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
52.Vibration induced fatigue reliability of BGA packages

机译：振动引起的BGA封装的疲劳可靠性
- 作者：Yao Hsu;Wei-Kuo Kong;Chih-Yen Su;Wen-Fang Wu;Ming-Wei Liu
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
53.Flexible opto-electrical interconnect module for consumer electronic application

机译：用于消费电子应用的柔性光电互连模块
- 作者：Sheng-Ho Huang;Chun-Hsing Lee;Jen-Hao Yeh;Yuan-Chin Chen;Yu-Ming Huang;Fu-Yi Cheng;Hung-Lien Hu;Mu-Tao Chu
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
54.The high frequency parasitic effect characterization of packages with test chip inside

机译：内部带有测试芯片的封装的高频寄生效应表征
- 作者：Kun-Fu Tseng;Tyler Lee;Ben-Je Lwo
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
55.Interfacial reactions between Sn-9Zn+Cu lead-free solders and the Au substrate

机译：Sn-9Zn + Cu无铅焊料与Au基底之间的界面反应
- 作者：Liou Wei-kai;Yen Yee-wen
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
56.Feasibility and bonding strength for gold stud bumps thermosonic flip-chip onto flex substrates with nonconductive pastes

机译：使用非导电胶将金钉凸块热超声倒装芯片粘贴到柔性基板上的可行性和粘结强度
- 作者：Cheng-Li Chuang;Jong-Ning Aoh;Qing-An Liao;Shi-Jie Liao;Guo-Shing Huang
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
- Flex substrates;
- non-conductive adhesive;
- thermosonic flip-chip bonding;
57.Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging

机译：基于低温无助焊剂的MEMS晶圆级封装的中间In / Ag层的键合界面材料演变
- 作者：Lee Chengkuo;Yu Daquan;Yu Aibin;Yan Liling;Wang Haitao;Lau John H.
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
58.Low-temperature fabrication method of carbon nanotubes-based gas sensor

机译：碳纳米管基气体传感器的低温制造方法
- 作者：Jung-Tang Huang;Chen-Han Lin;Po-Chih Chang
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
59.Minor Fe, Co, and Ni additions to SnAgCu solders for retarding Cu3Sn growth

机译：SnAgCu焊料中添加的少量Fe，Co和Ni可阻止Cu 3 Sn的生长
- 作者：Wang Y. W.;Kao C. R.
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
- Diffusion;
- Intermetallics;
- Soldering;
60.Effect of in addition on Sn-Ag-Sb lead-free solder system

机译：添加剂对Sn-Ag-Sb无铅焊料体系的影响
- 作者：Lee Hwa-Teng;Fok-Foo Lee;Ting-Fu Hong;Hsiao-Wei Chen
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
61.MLP/BP-based MIMO DFEs for suppressing ISI and ACI to recover distorted QPSK signal in severe ISI channels

机译：基于MLP / BP的MIMO DFE用于抑制ISI和ACI以恢复严重ISI信道中失真的QPSK信号
- 作者：Hsu Terng-Ren;Hsu Terng-Yin;Chao Kuan-Chieh;Chiang Shih-Yuan
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
62.Interfacial behavior between copper foil and tin upon thermal aging

机译：热老化后铜箔和锡之间的界面行为
- 作者：Chiu-Wen Lee;Shih-Ming Kuo;Kwang-Lung Lin
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
63.The effects of die thickness and bond height on wire sweep in multi-chip module and 3-Dimennsional packages

机译：芯片厚度和键合高度对多芯片模块和3维封装中扫线的影响
- 作者：Chen H.-S.;Huang C.-B.;Kung H.-K.
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
64.Influence of lanthanum addition on microstructure and properties of Sn-3.5Ag solder system

机译：镧对Sn-3.5Ag焊料体系组织和性能的影响
- 作者：Hwa-Teng Lee;Yin-Fa Chen;Ting-Fu Hong;Yu-Jing Huang
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
65.Fluorine thermal stability of ZnO:F films investigated by thermal desorption spectroscopy

机译：热解吸光谱法研究ZnO：F薄膜的氟热稳定性
- 作者：Shang-Chou Chang;Tien-Chai Lin;To-Sing Li;Tin-Wei Huang
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
- fluorine;
- thermal desorption;
- zinc oxide;
66.Effect of bonding temperature on eutectic interconnections in Chip-On-Film packages

机译：键合温度对薄膜芯片封装中共晶互连的影响
- 作者：Liu De-Shin;Shu-Shen Yeh;Chia-I Tsai;An-Hong Liu;Shu-Ching Ho
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
- Chip-on-film (COF);
- Eutectic interconnection;
- Finite Element Analysis (FEA);
- Inner Lead Bonding (ILB);
67.Wafer to wafer bonding using electroplated Co-Sn solder layer

机译：使用电镀的Co-Sn焊料层进行晶片间接合
- 作者：Kim S. H.;Yu Jin
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
68.Measurement of temperature distribution in SnAg3.5 flip-chip solder joints during current stressing using infrared microscopy

机译：使用红外显微镜测量电流应力期间SnAg3.5倒装芯片焊点中的温度分布
- 作者：Hsiao Hsiang-Yao;Chen Chih
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
69.Warpage measurement and simulation of flip-chip PBGA package under thermal loading

机译：热负荷下倒装芯片PBGA封装的翘曲测量和仿真
- 作者：Tsai M. Y.;Chang H. Y.
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
- Flip-chip PBGA packages;
- Shadow moiréSimulation;
- Warpage;
70.Low cost through silicon via solution suitable compatible with existing assembly infrastructure and suitable for single die and die stacked packages

机译：通过硅通孔解决方案的低成本，适合与现有组装基础架构兼容，并且适用于单芯片和芯片堆叠封装
- 作者：Humpston G.;Kidron B.;Kriman M.
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
71.Mechanical property measurement of nano-scale metal films on the novel paddle cantilever beams using four step phase-shifting method

机译：四步相移法测量新型桨式悬臂梁上纳米级金属膜的力学性能
- 作者：Yan-Ting Chen;Ya-Chi Cheng;Kuan-Jung Chung;Ming-Tzer Lin
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
72.Size and substrate effects on microstructure and shear properties of solder joints

机译：尺寸和基材对焊点组织和剪切性能的影响
- 作者：Gwo-Wei Lee;Jenn-Ming Song;Yi-Shao Lai;Ying-Ta Chiu;Chien-Wei Su
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
- shear deformation;
- size effect;
- solder joint;
- substrate effect;
73.New halogen-free laminate for advanced package substrate

机译：用于高级封装基板的新型无卤素层压板
- 作者：Takahiro Tanabe;Tetsuro Irino;Masahisa Ose;Kazunaga Sakai
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
74.Effect of piezoelectric fan height on flow and heat transfer for electronics cooling applications

机译：压电风扇高度对电子冷却应用中的流量和热传递的影响
- 作者：Abdullah M. K.;Abdullah M. Z.;Wong S. F.;Khor C. Y.;Ooi Y.;Ahmad K. A.;Ripin Z. Mohd;Mujeebu M. A.
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
75.The 3-axis CMOS-MEMS accelerometer include accelerator sensing method of Z-axis

机译：3轴CMOS-MEMS加速度计包含Z轴加速器感应方法
- 作者：Jung-Tang Huang;Chieh-Han Lee;Chiu-Chin Yang;Kai-Yuan Jeng;Jeng Lin;Kuo-Yu Lee
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
76.Microstructure and mechanical properties of Sn-Ag-xNi composite solder

机译：Sn-Ag-xNi复合焊料的组织和力学性能
- 作者：Lee Yang-Hsien
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
77.The role of Ni buffer layer between InSn solder and Cu metallization for hermetic wafer bonding

机译：NiSn焊料和Cu金属化层之间的Ni缓冲层在气密性晶圆键合中的作用
- 作者：Yu Daquan;Lee Chengkuo;Lau John H.
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》
78.Conduction soldering: Facts, fiction and best practices

机译：导电焊接：事实，虚构和最佳实践
- 作者：Wood Paul
- 会议名称：《Electronic Materials and Packaging,EMAP, 2008 International Conference on》