FLIP-CHIP BONDING STRUCTURE WHERE CONDUCTIVE PASTE IS FORMED IN A BUMP AND A FLIP-CHIP BONDING METHOD

摘要

PURPOSE: A flip-chip bonding structure and a flip-chip bonding method are provided to enhance adhesive force between conductive pads of bump and substrate by forming conductive paste in a bump and to improve the reliability of products.;CONSTITUTION: A flip-chip bonding structure comprises a substrate(100) with a plurality of conductive pads(101) for delivering electric signal; an electric device(120) in which a plurality of bumps(121) for the flip chip bonding is formed; and liquid adhesives(110) applied between the substrate and electric device for flip-chip bonding the substrate and electric device. The conductive paste(122) is formed on the bump of the electric device.;COPYRIGHT KIPO 2010