SEMICONDUCTOR PACKAGE, CAPABLE OF PREVENTING THE GENERATION OF SHORT-CIRCUIT BETWEEN WIRES DUE TO A SWEEPING PHENOMENON

摘要

PURPOSE: A semiconductor package is provided to stack semiconductor chips with a stair shape using dummy parts which are arranged on one side of a substrate.;CONSTITUTION: Bond-fingers(104) are arranged on the upper side of a substrate(102). A plurality of semiconductor chips is stacked on the upper side of the substrate. The plurality of semiconductor chips has a plurality of bond-pads(108). A dummy part(110) includes a conductive pattern(114) which is connected with the bond-fingers. The conductive pattern includes a via-wiring which connects circuit wirings.;COPYRIGHT KIPO 2010