Stacked hybrid interposer through silicon via (TSV) package

摘要

An integrated circuit (IC) device is provided. The IC device includes a first die having a surface with a first pad formed thereon, a second die having a surface with a second pad formed thereon, and a substrate interposer that couples the first pad to the second pad. The substrate interposer is coupled to the surface of the first die and the surface of the second die.