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INTEGRATED MEMS SENSOR DEVICE, CAPABLE OF INCREASING THE AMOUNT OF A SEMICONDUCTOR SUBSTRATE MATERIAL AND DECREASING THE PCB SPACE OF A PACKAGED DEVICE
INTEGRATED MEMS SENSOR DEVICE, CAPABLE OF INCREASING THE AMOUNT OF A SEMICONDUCTOR SUBSTRATE MATERIAL AND DECREASING THE PCB SPACE OF A PACKAGED DEVICE
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机译:集成式MEMS传感器设备,能够增加半导体基板材料的数量并减小封装设备的PCB空间
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摘要
PURPOSE: An integrated MEMS(Micro Electro Mechanical System) sensor device is provided to reduce a space, which is occupied by a sensor.;CONSTITUTION: An integrated MEMS(Micro Electro Mechanical System) sensor device comprises a first substrate, a second substrate, one or more MEMS sensors and one or more additional sensors. The first substrate comprises a surface unit. The second substrate is connected to the surface of the first substrate. A cavity(230) is defined between the first and second substrates. The MEMS sensors are at least partially arranged on the first substrate and are communicated with the cavity.;COPYRIGHT KIPO 2011
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