首页> 外国专利> INTEGRATED MEMS SENSOR DEVICE, CAPABLE OF INCREASING THE AMOUNT OF A SEMICONDUCTOR SUBSTRATE MATERIAL AND DECREASING THE PCB SPACE OF A PACKAGED DEVICE

INTEGRATED MEMS SENSOR DEVICE, CAPABLE OF INCREASING THE AMOUNT OF A SEMICONDUCTOR SUBSTRATE MATERIAL AND DECREASING THE PCB SPACE OF A PACKAGED DEVICE

机译:集成式MEMS传感器设备,能够增加半导体基板材料的数量并减小封装设备的PCB空间

摘要

PURPOSE: An integrated MEMS(Micro Electro Mechanical System) sensor device is provided to reduce a space, which is occupied by a sensor.;CONSTITUTION: An integrated MEMS(Micro Electro Mechanical System) sensor device comprises a first substrate, a second substrate, one or more MEMS sensors and one or more additional sensors. The first substrate comprises a surface unit. The second substrate is connected to the surface of the first substrate. A cavity(230) is defined between the first and second substrates. The MEMS sensors are at least partially arranged on the first substrate and are communicated with the cavity.;COPYRIGHT KIPO 2011
机译:目的:提供一种集成的MEMS(微机电系统)传感器设备,以减少传感器占用的空间。组成:一种集成的MEMS(微机电系统)传感器设备,包括第一基板,第二基板,一个或多个MEMS传感器和一个或多个其他传感器。第一基板包括表面单元。第二基板连接到第一基板的表面。在第一和第二基板之间限定腔体(230)。 MEMS传感器至少部分地布置在第一基板上并与腔连通。; COPYRIGHT KIPO 2011

著录项

  • 公开/公告号KR20100130561A

    专利类型

  • 公开/公告日2010-12-13

    原文格式PDF

  • 申请/专利权人 HONEYWELL INTERNATIONAL INC.;

    申请/专利号KR20100052106

  • 发明设计人 WITHANAWASAM LAKSHMAN;

    申请日2010-06-03

  • 分类号G01D21/02;B81B7/02;B81B7/04;H01L21/00;

  • 国家 KR

  • 入库时间 2022-08-21 17:53:09

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