PCB LIGHT SENSOR SUBSTRATE DEVICE CAPABLE OF BEING MULTI CHIP ARRAY BY INTEGRATED PCB AND COPPER ALLOY SUBSTRATE

摘要

The present invention relates to a substrate device for an optical sensor capable of applying a multi-chip array by integrating a printed circuit board (PCB) and a copper alloy substrate. The present invention provides a first substrate and a second substrate in the form of two frames disposed vertically to face each other; and a guide bar formed on each side of the first substrate and the second substrate, the first substrate being made of a PCB material, and the second substrate being made of a copper alloy material. The first substrate includes an upper substrate on which a top pattern is formed and a lower substrate on which a bottom pattern is formed, and is connected to each other through via holes formed in each substrate. The upper substrate and the lower substrate of the first substrate each have a predetermined size of grooves formed at positions corresponding to each other. An insulating layer is formed in a predetermined portion of the lower substrate. In the second substrate, a light emitting part is formed in a die-bonding method in a portion exposed to the outside through grooves formed in the upper and lower substrates of the first substrate.