Bonding of Al Wires to Copper Contacts on PCBs and Alumina Substrates - a Comparative Study

摘要

The use of copper conductive paste and copper laminates in manufacture of electronic circuits is getting wider and wider. It is stimulated both by economical and technical factors. The electric connections between semiconductor chips and substrates are usually realized by wire bonding. One of the most important problem, which must be solved properly is the suitable quality of bonds.