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Footprint Study of Ultrasonic Wedge-Bonding with Aluminum Wire on Copper Substrate

机译：铜基板上铝线超声波楔焊的足迹研究

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I. Lum; M. Mayer; Y. Zhou;
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1. Footprint Study of Ultrasonic Wedge-Bonding with Aluminum Wire on Copper Substrate [J] . I.LUM M.MAYER, Y.ZHOU Journal of Electronic Materials . 2006,第3期

机译：铜基铝线超声楔形结合的足迹研究
2. Welding of Braided Wire and Various Metal Specimens Using 20 kHz Ultrasonic Complex Vibration Welding Equipments - Welding of Copper, Bimetal, Braided Wires, Aluminum and Copper Foils [J] . Jiromaru Tsujino, Takashi Yokozuka, Shinichiro Suga, 電子情報通信学会技術研究報告. 超音波. Ultrasonics . 2010,第338期

机译：使用20 kHz超声波复合振动焊接设备焊接编织线和各种金属试样-铜，双金属，编织线，铝和铜箔的焊接
3. Welding of Braided Wire and Various Metal Specimens Using 20 kHz Ultrasonic Complex Vibration Welding Equipments: Welding of Copper, Bimetal, Braided Wires, Aluminum and Copper Foils [J] . Jiromaru Tsujino, Takashi Yokozuka, Shinichiro Suga, 電子情報通信学会技術研究報告 . 2010,第338期

机译：使用20 kHz超声波复合振动焊接设备焊接编织线和各种金属试样：铜，双金属，编织线，铝和铜箔的焊接
4. Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-off Method [C] . Heeseon Bang, Hongjun Jl, Mingyu Ll, International Welding/Joining Conference-Korea . 2008

机译：机械剥离方法铜基上超声铝丝楔粘合的裂缝研究
5. Evaluation of mechanical properties of Aluminum-Copper cold sprayed and alloy 625 wire arc sprayed coatings. [D] . Bashirzadeh, Milad. 2014

机译：铝铜冷喷涂和625合金电弧喷涂的机械性能评估。
6. Effect of Temperature Distribution in Ultrasonically Welded Joints of Copper Wire and Sheet Used for Electrical Contacts [O] . Jeyaraj Pradeep Kumar 2018

机译：温度分布对电触点用铜线和板的超声焊接接头的影响
7. A thermal cycling reliability study of ultrasonically bonded copper wires [O] . Arjmand Elaheh, Agyakwa Pearl A., Corfield Martin R., 2016

机译：超声焊接铜线的热循环可靠性研究
8. Evaluation of Aluminum-Coated Wires as Reinforcement for Articulated Concrete Mattresses; Supplementary Comparative Tests of Stainless and Copper-Clad Steel Wires [R] . Pepper, L. 1964

机译：评定铝涂层钢丝作为铰接混凝土床垫的加固;不锈钢和铜包钢线的补充对比试验

Footprint Study of Ultrasonic Wedge-Bonding with Aluminum Wire on Copper Substrate

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