SUBSTRATE, METHOD OF ATTACHING A DIE, AND A METHODS OF MANUFACTURING AN SEMICONDUCTOR DEVICE AND PCB USING THE SAME, CAPABLE OF INCREASING PRODUCTION SPEED WHILE INCREASING THE COMBINING FORCE OF MOUNTING A DYE

摘要

PURPOSE: A substrate, method of attaching a die, and a methods of manufacturing an semiconductor device and PCB using the same are provided to mount a die to be matched to a dye attach pattern by using the adhesion between a liquid adhesive and the surface of the dye.;CONSTITUTION: A substrate has a die attach pattern. A silicon dioxide oxide film(110) is formed on one side of the substrate. A liquid adhesive(500) is coated on the die attach pattern. A die(700) having a contact with the liquid adhesive is arranged on the liquid adhesive. The liquid adhesive is dried. The die attach pattern is a protrusion or a groove portion formed in the surface of the substrate.;COPYRIGHT KIPO 2011