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BEAM-INDUCED DEPOSITION OF LOW-RESISTIVITY MATERIAL

机译:束流诱导的低电阻率材料沉积

摘要

PROBLEM TO BE SOLVED: To provide a method of beam deposition to deposit a low-resistivity metal.;SOLUTION: A precursor capable of depositing low-resistivity metallic material of a methylated or ethylated metal such as hexamethylditin is induced toward a surface of a sample. A desired position on the surface of the sample is irradiated with a gallium focused ion beam and a tin film having a resistivity as low as 40 μΩcm is deposited on the position.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种用于沉积低电阻率金属的电子束沉积方法;解决方案:能够沉积甲基化或乙基化金属的低电阻率金属材料(例如六甲基二锡)的前驱物朝向样品表面。用镓聚焦离子束辐照样品表面上的所需位置,并在该位置上沉积电阻率低至40μΩcm的锡膜。版权所有:(C)2012,JPO&INPIT

著录项

  • 公开/公告号JP2012158833A

    专利类型

  • 公开/公告日2012-08-23

    原文格式PDF

  • 申请/专利权人 FEI CO;

    申请/专利号JP20120014799

  • 发明设计人 CHANDLER CLIVE D;RANDOLPH STEVEN;

    申请日2012-01-27

  • 分类号C23C16/44;C23C16/18;C23C16/48;H01L21/285;

  • 国家 JP

  • 入库时间 2022-08-21 17:44:23

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