首页> 外国专利> A NONVOLATILE MEMORY DEVICE USING CHARGE TRAPS OF SILICON-RICH OXIDES AND A MANUFACTURING METHOD THEREOF

A NONVOLATILE MEMORY DEVICE USING CHARGE TRAPS OF SILICON-RICH OXIDES AND A MANUFACTURING METHOD THEREOF

机译:利用富硅氧化物电荷陷阱的非易失性存储器件及其制造方法

摘要

PURPOSE: A non-volatile memory device using a charge trap of an overflowing silicon oxide film and a manufacturing method thereof are provided to utilize deformity as a charge storage trap by forming SiO2/SiOx/SiO2 memory device structures by ion beam sputtering deposition. CONSTITUTION: A tunneling SiO2 layer is formed on an n-type Si wafer. The tunneling SiO2 layer is formed by ion beam sputtering deposition. An overflowing silicon oxide film is formed on the tunneling SiO2 layer. A control oxide film is formed on the tunneling SiO2 layer. An Al electrode of a diameter of 200micrometers is deposited on a sample in order to measure capacitance-voltage of a metal-oxide-semiconductor capacitor.
机译:目的:提供一种使用溢流的氧化硅膜的电荷陷阱的非易失性存储器件及其制造方法,以通过离子束溅射沉积形成SiO2 / SiOx / SiO2存储器件结构,利用变形作为电荷存储陷阱。组成:在n型硅晶片上形成了隧道SiO2层。通过离子束溅射沉积形成隧道SiO 2层。在隧穿SiO 2层上形成溢出的氧化硅膜。在隧穿SiO 2层上形成控制氧化物膜。在样品上沉积直径为200微米的Al电极,以测量金属氧化物半导体电容器的电容电压。

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