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Atmospheric Plasma Etching Device for Opening Of Pad Region On TFT Substrate, And Plasma Etching Method Using The Same
Atmospheric Plasma Etching Device for Opening Of Pad Region On TFT Substrate, And Plasma Etching Method Using The Same
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机译:TFT基板上的焊盘区域的开放式等离子刻蚀装置及使用该装置的等离子刻蚀方法
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摘要
PURPOSE: An atmospheric plasma etching device for opening the pad region of a TFT substrate and plasma etching method using the same are provided to open the pad region of the TFT substrate without an expensive photo process, thereby saving manufacturing costs. CONSTITUTION: A plasma generating unit(200) comprises an electrode module(210) including an anode(210-1) and a cathode(210-2). A slit hole(211) for spraying plasma flame to the pad region of a TFT substrate(100) is formed on the anode. An etching unit(300) comprises an exhaustion adjusting module(320). A sample transfer module(310) includes an align device(312) which matches the pad region of a substrate on a stage with the slit hole. The etching unit is located on the plasma generating unit.
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