Series chip bonding distance revision device for flexible embedded packaging

摘要

The present invention relates to a continuous chip clearance for bonding correcting device for flexible embedded manufacturing, embedding a chip on flexible board (Embedding) and with the solder bump in the step of continuously bonded to the ultra-small chip using a roll when the flexible embedded prepared phase in accordance with the thickness of different sizes (height) of the upper and lower roller chip clearance adjustment is possible between with a tiny chip to quickly and reliably be the heating pipe patterns within limits junction to be bonded to a flexible substrate of, between the lower roller relates to the play compensating device for a continuous chip bonding is available for the embedded flexible manufacturing fast production with simplification of the process by continuously bonded to the chip by changing the interval. Continuous chip bonding gap correction device for a flexible manufacture of the present invention for this is embedded, Plectranthus supple substrate and brought to a predetermined width to be supplied in one direction; Tiny chip to be mounted on the metal pads of the Plectranthus supple substrate provided with a solder pump and having a predetermined height; Beuraketreul down, but that installation of the mounting substrate Plectranthus supple incoming and outgoing the tiny chip is mounted facing up or down to the bottom bracket roller trillion selectively elevating mounted vertically; And a magnetic sensor detects the magnetic field changes between the roller action to control the upper and lower roller gap; It consists. ;