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Uninterrupted chip bonding device that use series chip bondingyong variableness diameter roll for flexible embedded packaging
Uninterrupted chip bonding device that use series chip bondingyong variableness diameter roll for flexible embedded packaging
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机译:不间断的芯片键合装置,使用可变直径卷的串联芯片键合进行柔性嵌入式包装
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摘要
PURPOSE: A continuous chip bonding device is provided to consecutively and rapidly bond a plurality of micro-miniature chips by using a roll having variable diameter and to enhance efficiency by selectively heating and pressing a portion in which the chip is located. CONSTITUTION: A continuous chip bonding device which uses a variable diameter roll is composed of a flexible printed circuit board(10), a micro-miniature chip(20), and a roller tub(30). The flexible printed circuit board is provided to one direction with a predetermined width. A plurality of metal pads(12) installed on the flexible printed circuit board is used for electrical connection of the micro-miniature chip and the flexible printed circuit board. The flexible printed circuit board comprises plurality of metal pads having various shapes in order to accept the micro-miniature chip. A solder pump(22) is formed on the metal pad of the flexible printed circuit board.
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