PURPOSE: A continuous chip bonding device is provided to consecutively and rapidly bond a plurality of micro-miniature chips by using a roll having variable diameter and to enhance efficiency by selectively heating and pressing a portion in which the chip is located. CONSTITUTION: A continuous chip bonding device which uses a variable diameter roll is composed of a flexible printed circuit board(10), a micro-miniature chip(20), and a roller tub(30). The flexible printed circuit board is provided to one direction with a predetermined width. A plurality of metal pads(12) installed on the flexible printed circuit board is used for electrical connection of the micro-miniature chip and the flexible printed circuit board. The flexible printed circuit board comprises plurality of metal pads having various shapes in order to accept the micro-miniature chip. A solder pump(22) is formed on the metal pad of the flexible printed circuit board.
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