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A method for the production of light decoupling grid structures in a semiconductor body and light emitting semiconductor body

机译:在半导体本体和发光半导体本体中制造光解耦栅格结构的方法

摘要

It is a process for the production of light decoupling grid structures (115) in a semiconductor body (1) is specified. In the case of a process step, the semiconductor body (1) is provided, which a suitable for generating light active zone (120) contains. On a surface (111) of the semiconductor body (1) a mask layer (3) is produced. The mask layer (3) has a plurality of structural units (30), of which the position and size can be adjusted in a reproducible manner and is set in a targeted manner. The contours of the structural units (30) define a of the mask layer (3) uncovered portion (1111) of the surface (111) firmly. In a further method step, the semiconductor body (1) on the of the mask layer (3) uncovered portion (1111) of the surface (111) for the formation of the light decoupling grid structures (115) etched.In addition, a light emitting semiconductor body (1) is specified.
机译:提出了一种在半导体本体(1)中制造光解耦栅格结构(115)的方法。在处理步骤的情况下,提供了半导体本体(1),其适合于产生光活性区(120)。在半导体本体(1)的表面(111)上,形成掩模层(3)。掩模层(3)具有多个结构单元(30),其结构和位置可以以可再现的方式调节并且以目标方式设置。结构单元(30)的轮廓牢固地限定了掩模层(3)的表面(111)的未覆盖部分(1111)。在另一方法步骤中,在用于形成光去耦栅格结构(115)的表面(111)的未覆盖部分(1111)的掩模层(3)的未覆盖部分(1111)上的半导体本体(1)被蚀刻。确定了发光半导体本体(1)。

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