Groove processing method of chemical mechanical planarization pad

摘要

A method of forming a chemical mechanical polishing pad. The method, there forming a chemical mechanical planarization pad by polymerizing a polymer precursor in one or more, having a surface, a step of forming a groove in said surface, defining the lands between the grooves Te, groove steps of contracting to a (L ₂₎ the length of the second land at the surface length of the first land on the surface from (L _1), having a first width, a step, a land A is smaller than _{(L 1)} the length of the land of the first land length of said second _{(L 2),} the groove has a width of the second _{(W 2), (W 1)} ≦ (X) is a _{(W 2),} and has a value ranging from 0.01 to 0.75, and a step (X).