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Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs

机译:在化学机械平坦化(CMP)焊盘中产生原位凹槽的方法以及新颖的CMP焊盘设计

摘要

Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify. CMP pads comprising novel groove designs are also described. For example, described here are CMP pads comprising concentric circular grooves and axially curved grooves, reverse logarithmic grooves, overlapping circular grooves, lassajous groves, double spiral grooves, and multiply overlapping axially curved grooves. The CMP pads may be made from polyurethane, and the grooves produced therein may be made by a method from the group consisting of silicone lining, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.
机译:提供了用于在CMP垫中产生原位凹槽的方法。通常,用于产生原位凹槽的方法包括以下步骤:对硅树脂衬里进行构图;将硅树脂衬里放置在模具中或模具中;向硅树脂衬里添加CMP垫材料;以及使CMP垫固化。还描述了包括新颖的凹槽设计的CMP垫。例如,这里描述的是包括同心圆形凹槽和轴向弯曲凹槽,反向对数凹槽,重叠的圆形凹槽,lassajous凹槽,双螺旋凹槽和多重重叠的轴向弯曲凹槽的CMP垫。 CMP垫可以由聚氨酯制成,并且其中产生的凹槽可以通过以下方法制成:硅树脂衬里,激光书写,喷水切割,3-D打印,热成型,真空成型,微接触印刷,热冲压及其混合物。

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