SEMICONDUCTOR LAYOUT SETTING DEVICE, SEMICONDUCTOR LAYOUT SETTING METHOD, AND SEMICONDUCTOR LAYOUT SETTING PROGRAM

摘要

PROBLEM TO BE SOLVED: To properly insert a repeater buffer while avoiding chip area increase.SOLUTION: A semiconductor device of a layout target includes: first and second power source domains; and wiring for connecting a connection source and a connection destination belonging to the second power source domain. A wiring inhibition and permission region setting section 120 sets an exclusive wiring inhibition region and a passing wiring permission region in the first power source domain on the basis of a repeater wiring maximum length which is a maximum wiring length with which a repeater buffer can drive. A wiring setting section 130 corrects the wiring on the basis of the exclusive wiring inhibition region and the passing wiring permission region. A repeater insertion section 140 sets the repeater buffer inserted into the wiring according to the repeater wiring maximum length. The exclusive wiring inhibition region permits the wiring connected in the first power source domain and inhibits passing wiring. The passing wiring permission region is a region in which the exclusive wiring inhibition region is excluded from the first power source domain and permits the passing wiring.