SEMICONDUCTOR SUBSTRATE SURFACE ETCHING DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE WHEREON UNEVEN SHAPES ARE FORMED UPON SURFACE USING SAID DEVICE

摘要

while using a gas that causes the semiconductor substrate and the heat generating reaction as an etching gas , compatible semiconductor substrate surface to mass production to be the problem to provide an apparatus for etching . A load lock chamber , the pressure in the etching chamber and the atmospheric pressure or less as possible , unload lock chamber , and a transport mechanism for transporting the tray accommodating the semiconductor substrate to the unload lock chamber from the load lock chamber via the etching chamber , the semiconductor substrate and / or a surface of a semiconductor substrate etching apparatus having a cooling mechanism for cooling the tray and provides a surface etching device having a plurality of nozzles for ejecting an etching gas toward the surface of the semiconductor substrate in the etching chamber accommodated in the tray . ;