首页>
外国专利>
SOLDER BALL ATTACH METHOD AND AN APPARATUS THEREOF, CAPABLE OF SETTLING A SOLDER BALL IN AN ACCOMMODATION HOLE THROUGH NON-CONTACT METHOD
SOLDER BALL ATTACH METHOD AND AN APPARATUS THEREOF, CAPABLE OF SETTLING A SOLDER BALL IN AN ACCOMMODATION HOLE THROUGH NON-CONTACT METHOD
展开▼
机译:能够通过非接触方法在容纳孔中装设锡球的锡球附着方法及其装置
展开▼
页面导航
摘要
著录项
相似文献
摘要
PURPOSE: A solder ball attach method and an apparatus thereof are provided to maintain uniform size of a completed bump by excluding physical contact in the process of settling a solder ball in an accommodation hole of an attach mask.;CONSTITUTION: A substrate is fixed to a substrate chuck. Flux is dotted in a number of positions which are pattern-arranged to settle a solder ball (mB) in the substrate. An attach mask (90) is fixed to the upper side of the substrate as being arranged. A number of solder balls are dropped down on the surface of the attach mask of the substrate chuck from a solder ball supply unit (140). The substrate chuck vibrates so that the solder ball dropped on the surface of the attach mask is settled in an accommodation hole. The attach mask is separated by being moved separately from the substrate.;COPYRIGHT KIPO 2013
展开▼