SOLDER BALL ATTACHMENT METHOD AND AN APPARATUS THEREOF, CAPABLE OF SETTLING SOLDER BALL OF MINUTE SIZE IN AN ACCEPTANCE HOLE IN NON-CONTACT METHOD

摘要

PURPOSE: A solder ball attachment method and an apparatus thereof are provided to settle a solder ball in an acceptance hole in a short time, by dropping the solder ball to the surface of an attach mask as moving along a path connecting the center to the edge of a substrate.;CONSTITUTION: A substrate is fixed to a flux substrate chuck. Flux is dotted at a number of pattern-arranged positions to settle a solder ball (mB) on the substrate. An attach mask (90) is fixed to the upper side of the substrate in which an acceptance hole (90a) is arranged in the pattern-arranged positions. A number of solder balls drops to the surface of the attach mask of the substrate chuck from a solder ball feeder (140). An attach substrate chuck (130) vibrates so that the solder ball dropped to the surface of the attach mask is settled in the acceptance hole. The attach mask is separated by moving the attach mask from the substrate separately.;COPYRIGHT KIPO 2013