SOLDER BALL SETTLEMENT METHOD, A SOLDER BALL ATTACHMENT METHOD USING THE SAME AND AN APPARATUS THEREOF, CAPABLE OF SETTLING A SOLDER BALL ON A SUBSTRATE WITH A PREESTABLISHED PATTERN

摘要

PURPOSE: A solder ball settlement method, a solder ball attachment method using the same and an apparatus thereof are provided to settle a solder ball in a number of accommodating parts formed on a holder substrate through non-contact method.;CONSTITUTION: A holder substrate (H) comprising a number of accommodation parts is fixed to a fixing part (135). The accommodation parts are formed as being depressed. A number of solder balls (mB) are dropped onto the holder substrate from a solder ball feeder (140). The solder ball dropped on the surface of the holder substrate moves along the plate side of a columnar direction (131x) of the holder substrate. The solder ball is moved along the direction having columnar direction component along the surface of the holder substrate, by applying negative pressure to the accommodation parts of the holder substrate.;COPYRIGHT KIPO 2013