Joint reliability evaluation methods of a BGA solder ball terminal

摘要

In recently, a lot of BGA (ball grid array) packages, which are one of the semiconductor packages, are used to the reduction of the mounting area of the printed wiring board. The ball share strength measurement is generally used as a method of evaluating the joint quality between ball terminal of this BGA package and BGA package substrate. However, there was a problem of not detecting an abnormal connection of the interface easily because the ball share strength measurement was a method of measuring share strength in parallel for the substrate of the BGA package. We investigated the new ball share strength measurement method, which can detect the abnormal connection of the interface.