Wafer Polishing Velocity Controlling Apparatus, Wafer Polishing Apparatus and Polishing Method Using The Same

摘要

PURPOSE: A wafer polishing velocity control device, a wafer polishing device, and a wafer polishing method using the same are provided to improve the quality of a semiconductor product by polishing a wafer to uniform thickness. CONSTITUTION: A wafer holder(100) comprises a holder body(110) and a rotary shaft(120) rotating the holder body. A wafer(5) is mounted on the holder body. A polishing pad(210) polishes the wafer while contacting the wafer mounted on the wafer holder. A piezo actuator(300) measures the thickness of the polished wafer. The piezo actuator comprises a piezo element in which an electrode is installed on both sides. A slurry dispenser supplies slurry between the back side of the wafer and the polishing pad.