Manufacture of through-silicon vias silicon wafer

摘要

Method of manufacturing through silicon vias comprises etching a plurality of through holes in the silicon plate. Oxide liner is deposited on the bottom wall and the side wall of the through hole and the surface of the silicon plate. Next, a metal conductor is deposited in the through hole. In another version, it is deposited on the back surface of the silicon nitride passivation layer may be used simultaneously with an oxide liner is exposed the silicon substrate plate. [Selection] Figure Figure 1G