机译:热冲击试验中自支撑晶片中硅通孔的失效分析
The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332, United States;
School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA 30332, United States;
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332, United States;
School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA 30332, United States,School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332, United States;
The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332, United States;
机译:3个
机译:耦合仿真以确定氧化物PECVD中的整个晶片变化对硅通孔的电学和可靠性参数的影响
机译:3D集成电路堆叠硅片中的硅通孔和键合层的电气和机械性能
机译:通过电测量对晶圆级封装中的硅通孔(TSV)进行性能比较和分析
机译:NAND闪存的晶片探头和包装测试失败分析
机译:量身定制飞秒的1.5μm贝塞尔光束以制造高纵横比的硅通孔
机译:具有电阻开放缺陷的硅通孔通孔的邮政测试