首页> 外国专利> In production method of the field-effect transistor, the electronic equipment and the field-effect transistor and with respect to

In production method of the field-effect transistor, the electronic equipment and the field-effect transistor and with respect to

机译:在场效应晶体管,电子设备和场效应晶体管的制造方法中,关于

摘要

PPROBLEM TO BE SOLVED: To provide a field effect transistor not broken regardless of application of overvoltage and overcurrent without over-increasing the chip area. PSOLUTION: In the field effect transistor, a gate electrode 110, a drain electrode 109, a source electrode 108, and a protection diode (a protection diode electrode) 111 are disposed on a semiconductor layer. The drain electrode 109 is formed to surround a part or the entire of the surrounding of the protection diode 111, or a plurality of drain electrodes 109 are provided and formed such that the protection diode 111 is disposed between at least a pair of drain electrodes of the plurality of drain electrodes 109. PCOPYRIGHT: (C)2011,JPO&INPIT
机译:

要解决的问题:在不过度增加芯片面积的情况下,提供一种无论施加过压和过流而不会损坏的场效应晶体管。

解决方案:在场效应晶体管中,栅电极110,漏电极109,源电极108和保护二极管(保护二极管电极)111布置在半导体层上。漏电极109形成为围绕保护二极管111的一部分或全部周围,或者设置并形成有多个漏电极109,使得保护二极管111设置在保护二极管111的至少一对漏电极之间。多个漏电极109。

COPYRIGHT:(C)2011,JPO&INPIT

著录项

  • 公开/公告号JP5577713B2

    专利类型

  • 公开/公告日2014-08-27

    原文格式PDF

  • 申请/专利权人 日本電気株式会社;

    申请/专利号JP20100010539

  • 申请日2010-01-20

  • 分类号H01L29/808;H01L21/338;H01L21/337;H01L29/812;H01L27/095;H01L29/778;H01L29/78;H01L21/336;H01L29/786;H01L21/28;H01L29/41;H01L27/088;H01L21/8234;H01L27/06;H01L27/04;H01L21/822;H01L21/8232;

  • 国家 JP

  • 入库时间 2022-08-21 16:14:12

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