In the joint structure joint structure and consist of the Cu alloy for wiring sputtering target

摘要

PROBLEM TO BE SOLVED: To provide a technique by which wiring can be directly formed with Cu alloy on an insulating layer such as glass while saving an adhesion layer of Mo etc. and without applying heat treatment, and by which wiring having the good surface smoothness is formed.;SOLUTION: The Cu alloy for wiring includes by atomic, 0.01-0.5% Bi, 0.05-0.5% In and the balance Cu with inevitable impurities. A connection structure is provided in which an insulating layer is directly joined to Cu alloy wiring, the connection structure is characterized in that: the Cu alloy contains Bi and In and the Cu alloy wiring has a Bi segregated layer which is formed at the joining interface side to the insulating layer.;COPYRIGHT: (C)2012,JPO&INPIT