Cu ALLOY WIRING FILM, FLAT PANEL DISPLAY TFT ELEMENT USING THE Cu ALLOY WIRING FILM, AND Cu ALLOY SPUTTERING TARGET FOR MANUFACTURING THE Cu ALLOY WIRING FILM

摘要

Provided are a Cu alloy wiring film which uses Cu having a low electrical resistivity as a wiring material and is highly adhesive to a glass substrate without possibility of removal, a flat panel display TFT element manufactured by using the Cu alloy wiring film, and a Cu alloy sputtering target used for manufacturing the Cu alloy wiring film. A wiring film (2) which constitutes a flat panel display TFT element (1) and the sputtering target for manufacturing the film are provided. The sputtering target contains Cu as a main component, and at least one element selected from among Pt, Ir, Pd and Sm by 0.01-0.5 atom% in total. The wiring film (2) is laminated on the glass substrate (3), and a transparent conductive film (5) is laminated on the wiring film through an insulating film (4).