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Method and system for dicing substrates containing gallium and nitrogen material

机译:切割含有镓和氮材料的基板的方法和系统

摘要

The present disclosure relates generally to semiconductor techniques. More specifically, embodiments of the present disclosure provide methods for efficiently dicing substrates containing gallium and nitrogen material. Additionally the present disclosure provide techniques resulting in a optical device comprising a substrate having three or more corners, where at least one of the corners is defined by a dislocation bundle characterized by a diameter of less than 100 microns, the gallium and nitrogen containing substrate having a predefined portion free from dislocation bundle centers, an active region containing one or more active layers, the active region being positioned within the predefined region; and a conductive region formed within the predefined region.
机译:本公开总体上涉及半导体技术。更具体地,本公开的实施例提供了用于有效地切割包含镓和氮材料的基板的方法。另外,本公开内容提供了导致包括具有三个或更多个拐角的基板的光学器件的技术,其中至少一个拐角由特征在于直径小于100微米的位错束限定,含镓和氮的基板具有一无错位束中心的预定部分,一有源区包含一个或多个有源层,该有源区位于该预定区内;导电区域形成在预定区域内。

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