CHIP ASSEMBLY, METHOD FOR PRODUCING A CHIP ASSEMBLY, INTEGRATED CIRCUITS AND METHOD FOR PRODUCING AN INTEGRATED CIRCUIT

摘要

A chip arrangement is provided which comprises a carrier (404, 4041, 4042); at least one chip (4061, 4062), which is electrically connected to a carrier top (6141, 6142); an encapsulation material (948) that at least partially surrounds the at least one chip (4061, 4062) and the carrier top side (6141, 6142), the encapsulation material (948) on one or more lateral side (s) of the carrier (404, 4041, 4042) is formed; and a ceramic material (966) formed on a carrier bottom side (616) and on at least one side (968, 972) of the encapsulation material (948).