首页> 外国专利> A method for producing a trench structure with oxidation of clothing, for producing an integrated semiconductor circuit arrangement or of a chip, for producing a semiconductor component as well as with this method a semiconductor integrated circuit device, chip, produced a semiconductor device

A method for producing a trench structure with oxidation of clothing, for producing an integrated semiconductor circuit arrangement or of a chip, for producing a semiconductor component as well as with this method a semiconductor integrated circuit device, chip, produced a semiconductor device

机译:一种用于产生具有氧化作用的沟槽结构的方法,一种用于制造集成半导体电路装置或芯片的方法,一种用于制造半导体元件的方法以及一种利用该方法的半导体集成电路器件,芯片,一种半导体器件的制造方法

摘要

A method for producing a trench structure with oxide liner comprising the steps of:(a) providing a half conductor material region (20) with a surface area (20a),(b) forming a trench (30) extending from the surface area (20a) of the half conductor material region (20) into the interior of the half conductor material region (20) and a wall area (30b) and a bottom portion (30a) comprises,(c) lining of the inner or a part in the interior of the trench (30) with a first oxidation layer (40) by means of oxidative conversion of the material of the wall section (30b) and / or of the floor portion (30a) in the interior of the trench or in each case of a part thereof in a first oxidation step,(d) forming a material layer (50) in the interior of the trench (30) and as a result of a partial or complete lining of the interior of the trench (30) with the material layer (50) in a the trench (30) and not be filled to the first oxidation layer (40) directly or by means of an oxidation barrier layer (45) indirectly adjoining manner and(e) performing a second oxidation step and..
机译:一种用于制造具有氧化物衬里的沟槽结构的方法,该方法包括以下步骤:(a)提供具有表面积(20a)的半导体材料区域(20),(b)形成从该表面区域延伸的沟槽(30)。将半导体材料区域(20)的20a)放入半导体材料区域(20)的内部以及壁区域(30b)和底部(30a),包括(c)内衬或内衬的一部分借助于在沟槽内部或每个沟槽中的壁部分(30b)和/或底部部分(30a)的材料的氧化转化,在具有第一氧化层(40)的沟槽(30)内部。在第一氧化步骤中其一部分的情况下,(d)在沟槽(30)的内​​部形成材料层(50),并且由于沟槽(30)的内​​部的部分或全部衬里沟槽(30)中的材料层(50)并且不直接或通过氧化阻挡层(45)填充到第一氧化层(40) )间接邻接的方式,以及(e)执行第二氧化步骤,并且。

著录项

  • 公开/公告号DE10361697B4

    专利类型

  • 公开/公告日2011-08-11

    原文格式PDF

  • 申请/专利权人

    申请/专利号DE2003161697

  • 发明设计人

    申请日2003-12-30

  • 分类号H01L21/762;H01L21/336;H01L29/78;

  • 国家 DE

  • 入库时间 2022-08-21 17:48:04

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