Quad flat no-lead (QFN) package structure and a method of manufacturing the same .

摘要

An object of the present invention quad flat no-lead (QFN) package structure and a method of manufacturing the same.. A quad flat no-lead (QFN) package structure is disclosed. QFN package structure includes a metal substrate, a first outer die pads formed on the basis of the metal substrate, the first die that is coupled to the upper surface of the outer die pad. The QFN package structure includes a plurality of I / O pads formed based on the metal substrate, corresponding to the I / O pads, and a first metal layer including a plurality of inner leads extending in the vicinity of a plurality of dies including. The first metal layer, as the lead pitch of the plurality of inner leads is significantly reduced, is formed on a metal substrate by electroplating treatment of the multilayer. Further, QFN package structure comprises a second metal layer attached to the back surface of the metal wire and a plurality of I / O pads for connecting a die and a plurality of inner leads. Die plurality of inner leads and the metal wires are sealed with a molding compound. .. [Selection Figure] FIG. 16 (A).