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NO-EXPOSED-PAD QUAD FLAT NO-LEAD (QFN) PACKAGING STRUCTURES AND METHOD FOR MANUFACTURING THE SAME
NO-EXPOSED-PAD QUAD FLAT NO-LEAD (QFN) PACKAGING STRUCTURES AND METHOD FOR MANUFACTURING THE SAME
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机译:无外露四方扁平无铅(qFN)包装结构及其制造方法
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摘要
A no-exposed-pad quad flat no-lead (QFN) packaging structure is disclosed. The no- exposed-pad QFN packaging structure includes a metal substrate, a first die coupled to a top surface of the metal substrate, and a plurality of I/O pads formed based on the metal substrate and extends to proximity of the die. The no-exposed-pad QFN packaging structure also includes a first metal layer, which contains a plurality of inner leads corresponding to the plurality of I/O pads and extending to proximity of the die and is formed on the metal substrate by a multi-layer electrical plating process such that a lead pitch of the plurality of inner leads is significantly reduced. Further, the no-exposed-pad QFN packaging structure includes metal wires connecting the die and the plurality of inner leads, and a second metal layer formed on a back surface of the plurality of I/O pads. The die, the plurality of inner leads, and metal wires are sealed with a molding compound.
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