Barrel-plating quad flat no-lead (QFN) packaging structures and method for manufacturing the same

摘要

A barrel-plating quad flat no-lead (QFN) package structure and a method for manufacturing the same. The method includes: providing a metal substrate for a plurality of QFN components; forming a first photoresist film on a top surface of the substrate; forming a plating pattern in the first photoresist film; forming a first metal layer containing a plurality of inner leads; etching the substrate from the back surface of the substrate to form a plurality of I/O pads; filling sealant in the etched areas; attaching at least one die in a predetermined region on the top surface of the substrate; connecting the die and the inner leads using metal wires; sealing the die, the inner leads, and the metal wires with a molding compound; separating the resulting joint QFN components into individual QFN components; and forming a second metal layer on the back surface of the I/O pads.