QFN PACKAGE STRUCTURE AND QFN PACKAGING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a QFN package structure and a QFN packaging method which solve a problem that a foot of a lead frame deviates and can enhance an adhesive force of a surface mounting technology.SOLUTION: A QFN package structure 10 includes a thin film layer 20, a conductive layer 30, a chip 40, a sealing resin 50 and a plurality of projection metal lumps 60. The thin film layer 20 has a plurality of bore holes 23. The conductive layer 30 has a base seat 31 and a conductive circuit 33. The base seat 31 and the conductive circuit 33 are not mutually conducted and are arranged on the thin film layer 20, and the conductive circuit 33 is positioned on the bore hole 23. The chip 40 is fixed to the base seat 31, and is electrically connected to the conductive circuit 33. The sealing resin 50 covers the conductive layer 30 and the chip 40. The projection metal lump 60 is arranged in the bore hole 23, one end thereof is electrically connected to the conductive circuit 33, and the other end thereof projects from the bore hole 23.SELECTED DRAWING: Figure 1