QFN QFN QFN semiconductor package method of fabricating the same and mask sheet for manufacturing the same

摘要

The present invention relates to a QFN semiconductor package, a manufacturing method thereof, and a mask sheet for manufacturing the QFN semiconductor package, which can achieve excellent die bonding and wire bonding, effectively suppress leakage of a sealing resin, and increase the reliability of the QFN semiconductor package, and increase productivity and efficiency in a manufacturing process. The QFN semiconductor package is manufactured by forming contact depth in an adhesive layer of the mask sheet through a lamination process of imprinting a lead frame on the mask sheet.