QFN MANUFACTURING METHOD OF QFN SEMICONDUCTOR PACKAGE

摘要

The present invention relates to a method of manufacturing a QFN semiconductor package that separates a chip-mounted portion on which a semiconductor chip is mounted and a lead portion on which a plating film connected to the semiconductor chip is wired using a laser instead of a conventional half-etching during leadframe processing. At this time, before processing the lead frame, by attaching a protective film to the lower surface of the lead frame, it is possible to prevent contamination by the encapsulant and lower the incidence of defective products.